YSH20 Surface Mount Technology | Flip Chip Bonder

10µ

Accuracy

4,000

CPH Speed

0.6 - 18

mm2 die size

400 mm

wafer capable

Features

4,500 UPH (0.8 sec/unit)

+/- 10 µm (3σ) mounting accuracy (When using Yamaha’s standard components)

YWF wafer supply unit “6/8/12 inch”, “expand ring”, and “0 angle correction” applicable

0.6 × 0.6mm to 18 × 18mm components applicable

Model	YSH20
Applicable PCB	L50 x W30mm to L250 x W200mm ** “Up to L340 x W340mm” is applicable. Please contact us separately.
Mounting accuracy (when using Yamaha’s standard components)	[2F2F heads & multi-camera type] Repeatability (3): +/- 0.010mm/unit +/- 0.05 degree [4M4M heads & multi-camera type] ** under development Repeatability (3): +/- 0.010mm/unit +/- 0.05 degree
Mounting capability (under optimum condition)	[2F2F heads & multi-camera type] 4,500 UPH (0.8 sec/unit) excluding dipping 3,600 UPH (1.0 sec/unit) including dipping [4M4M heads & multi-camera type] under development 5,500 UPH (0.65 sec/unit) excluding dipping 4,500 UPH (0.8 sec/unit) ** including dipping
Component supply configuration	Wafer (6/8/12 inch flat ring), waffle tray, tape reel (8/12/16 mm width)
Applicable components	[Multi-camera] Flipchip: 0.6 x 0.6mm to 18 x 18mm Bump diameter 60μm or more Bump pitch 110 μm or more, Height 0.7mm or less SMD Chip: 0402 (Metric base) to 20 x 20mm, Height 6mm or less
Power supply	3-phase AC 200/208/220/240/380/400/416V +/- 10% 50/60Hz
Air supply source	0.5 MPa or more, in clean, dry state
External dimension ** excluding projections	L1,400 x W1,820 x H1,515mm (main unit only) L1,400 x W2,035 x H1,515mm (when YWF wafer supply unit is installed)
Weight	Approx. 2,470kg (main unit only) Approx. 2,780kg (when YWF wafer supply unit is installed)
* Specification and appearance are subject to change without prior notice.